CPU THERMAL GREASE 1.5 G (0.5 OZ.)

Helps a processor keep its cool.

Manhattan CPU Thermal Grease helps create maximum surface-to-surface conductivity between a microprocessor and the CPU cooler heat sink to reduce overheating risks. Specially formulated to reliably and easily fill manufacturing imperfections in the wafer and heat sink surfaces, Manhattan CPU Thermal Grease closes critical gaps that can reduce cooling effectiveness and increase possible failure.

• Silicone Compound
• Carbon Compound
• Metal Oxide Compound

• Thermal conductivity: >0.965 W/M-K
• Thermal impedance: <0.255 °C-IN2/W
• Specific gravity: >2.3
• Evaporation: <0.001%
• Bleed: <0.05%
• Dielectric constant A: >5.1
• Thixotropic index: 380 ±10 1/10 mm
• Operating temperature: -30 ~ 180° C
Physical
• Syringe dispenser with resealable cap
• 1.5 g (0.05 oz.)
Composition
• Silicone compounds, 50%
• Carbon compounds, 20%
• Metal oxide compounds, 30%